| 摘要 |
A thin-film heat sink comprises a heat sink film functioning as a heat sink and a bonding film for bonding the heat sink film to a base. The bonding film is an aluminum oxide (Al2O3) film formed using the CVD method and the heat sink film is an aluminum nitride (AlN) film. For the AlN film as the heat sink film, internal stress is compressive stress, whereas for the Al2O3 film as the bonding film, internal stress is tensile stress.
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