| 摘要 |
<p>A device for preventing wafer materials, such as semiconductor silicon wafers, held on a wafer cassette by inserting the wafers into respective wafer alignment grooves from contacting with adjacent wafers due to the larger width of the grooves than the thickness of the wafers to allow tilting thereof. The device is a rectangular frame mountable on the wafer cassette and provided on each of two oppositely facing sides with a wafer holding member in the form of a comb having comb teeth with the same regular pitch as that of the alignment grooves, the slit between adjacent comb teeth, into which the periphery of the wafer is inserted, having a width somewhat larger than the thickness of the wafer but smaller than the width of the wafer alignment groove to decrease the shaky condition of the wafer material.</p> |
