| 摘要 |
PROBLEM TO BE SOLVED: To prevent a package, a cover or a semiconductor product from being excessively stressed by heat generated in continuous-welding the package and the cover which constitute a device using a seam welder, to secure the airtightness of the device, and to prevent the characteristic deterioration of semiconductor parts in the device. SOLUTION: The seam welding machine is provided with a seam welding jig for holding a package which houses semiconductor parts while being brought into contact with the package and roller electrodes 6 moving while being touched with the upper face of the cover which closes an opening of the package. The seam welding jig is provided with a cooling tube 8 through which a refrigerant is made to flow, preventing the accumulation of heat at the seam welding jig, and enabling the device to perform continuous welding. COPYRIGHT: (C)2003,JPO |
