| 摘要 |
Electrical connection between two faces of a substrate and manufacturing process.The connection is made by a part (46) of a conducting or semi conducting substrate (20) completely surrounded by at least one electrically insulating trench (32, 36, 44). A contact pad (42) is located on the back face (40) and conducting tracks (38) are located on the front face. The connection is made through the substrate itself.Application to the manufacture of circuits, components, sensors, etc. |
