| 摘要 |
The module incorporates a supporting film (5) with contact surfaces (2) on one side, and windows for the integrated circuit (4) and its wire bonds (3) which are encapsulated in resin (7). A ring (6) of thermally activated adhesive secures the underside of the module into the recess in the body (1) of the card. The assembly is carried out in two stages. First the adhesive is heated and then the module is inserted into the recess under pressure with or without additional heating. |
