ASHING APPARATUS WITH IMPROVED DOOR STRUCTURE FOR FABRICATING SEMICONDUCTOR

摘要

PURPOSE: An ashing apparatus with an improved door structure for fabricating a semiconductor is provided to shorten an interval of vacuum set time and to prevent a vacuum error by making a door closely attached to a chamber within a short interval of time. CONSTITUTION: A predetermined space for performing an ashing process is formed in a process chamber(11). An upward and downward driving door(23) is vertically transferred by the first driver unit(21) to open or close an opening(11a) through which a wafer is loaded or unloaded, installed in a side of the process chamber. A forward and backward driving door(25) moves up and down according to the operation of the upward and downward driving door. The forward and backward driving door is driven forward and backward by the second driver unit(27) when located in the position of the opening to be closely attached to the outer wall of the process chamber including the opening.