METHOD FOR FABRICATING METAL CLAD LAMINATE FOR PCB

摘要

PURPOSE: A method for fabricating a metal clad laminate for PCB(Printed Circuit Board) is provided to reduce a fabricating cost and minimize an electric characteristic and a mechanical characteristic of a dielectric by coating directly a conductive metal foil on a single dielectric structure. CONSTITUTION: A fine projection is formed on one side of a fluoric resin insulating layer(2). A roughening process for one side of a conductive metal foil(1) is performed. A stacked structure is formed by stacking a roughened side of the conductive metal foil(1) on the side having the fine projection of the fluoric resin insulating layer(2). A plurality of fluoric resin insulating layers(3) are stacked on the other side without the fine projection of the fluoric resin insulating layer(2). The stacked structure is pressed and heated under a state of vacuum.