| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an ultrasonic bonding device and an ultrasonic bonding method in which, even when the resonance frequency of a vibrator changes to a large extent due to a load, it is possible to surely follow up the resonance frequency of a predetermined vibration mode to assure a stable bonding process. <P>SOLUTION: In ultrasonic bonding to pressure-bond electronic components to a substrate using a load and vibration, a relation among a basic frequency f0 indicating the resonance frequency under a non-loading condition, a load resonance frequency under the non-loading condition and a pressing load is stored in a storage means. Moreover, a self-running frequency when the operation of the vibrator is started is outputted with an addition of a frequency offset α, to the basic frequency f0, which is set based on the load resonance frequency corresponding to the pressing load during the relevant bonding operation. Accordingly, even when the resonance frequency of the vibrator changes to a large extent to f1 from f0 due to the load, the frequency surely follows the resonance frequency f1. <P>COPYRIGHT: (C)2003,JPO |
