| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device in which a mounting area is reduced, a wireless miniaturized package is obtained and a fine conductive pattern form can be obtained. <P>SOLUTION: A conductive pattern is formed by working a metal film over a supporting substrate by lithography and etching and after a semiconductor chip is fixed, the semiconductor chip and the conductive pattern are connected by a metal piece. After sealing with insulating resin, the supporting substrate is removed and the conductive pattern is exposed from the insulating resin. The fine conductive pattern can be formed, the package is miniaturized, the mounting area is reduced and heat radiation characteristics can be improved. <P>COPYRIGHT: (C)2003,JPO |
