| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a print failure and to improve communication characteristic. <P>SOLUTION: In this IC card, an electronic part 5 with a designated thickness is provided between a first sheet member 1 having at least an image receiving layer 6 for receiving a subliminating or thermal diffusive dye image by a thermal transfer recording method and a second sheet member 2 at least having a writing layer 7, and at least the first sheet member 1, the second sheet member 2 and an electronic part 5 are stacked through adhesives 3, 4. The IC card rigidity creep is 500 g/mm<SP>2</SP>or more. <P>COPYRIGHT: (C)2003,JPO |
