| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate mounting structure surely formed with an underfill material unfilled region. <P>SOLUTION: The substrate mounting structure is mounted with a chip like OEIC chip 1 to a mounting substrate 5 in the form of a flip chip, and filled with the underfill material between the substrate 5 and the chip 1. A groove 3 for preventing the invasion of the underfill material is formed at at least either a part of the mounting substrate or chip 1, and there is provided the underfill material unfilled region. <P>COPYRIGHT: (C)2003,JPO |
