| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce component mounting defects when mounting electronic components onto a board. <P>SOLUTION: In a mounting device for mounting components housed in a tape feeder 4 onto a printed board P, this surface mounting device is provided with a plurality of suction nozzles 14 for sucking the components from the tape feeder 4; a fixed camera 1 for imaging suction conditions of the components sucked by each suction nozzle 14; and servo mechanism 41, 42, 43 and 44 along X-axis, Y-axis, Z-axis, and R-axis, respectively, and an integrated controller 35, which correct a component mounting direction sucked by the suction nozzles 14 by use of a suction condition image from the fixed camera 15, examine interference between the suction nozzle 14 and the components E previously mounted on the printed board P, and either mount the sucked component when not interfered or suspend mounting the sucked component when interfered, as a result of the interference examination. <P>COPYRIGHT: (C)2003,JPO |
