| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which the strength of a thin film diaphragm can be inspected efficiently, and inspection equipment for use therein. SOLUTION: A closed space 2a is formed by pasting a dicing tape 6 to a semiconductor wafer 1 in which a recess 2 and a diaphragm 3 are formed every unit of a chip 11. Subsequently, the semiconductor wafer 1 is diced into the chips 11. Inspection equipment comprising a base 21, a lid 22, and a gas generator 27 is prepared and the diced semiconductor wafer 1 is mounted on the base 21 together with a dicing ring 5. Thereafter, gas is introduced into a space 25 formed between the lid 22 and the base 21 and the semiconductor wafer 1 and pressurized. Stress is applied to the diaphragm 3 by generating a pressure difference between the inner pressure and the outer pressure of the closed space 2a thus breaking the diaphragm 3 having strength lower than a specified level. Finally, the chips 11 each having a broken diaphragm 3 are removed thus manufacturing an appropriate semiconductor device. COPYRIGHT: (C)2003,JPO
|
