| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which external electrodes can be formed surely only on end faces of a component body of each electronic chip component by dry-plating. SOLUTION: A holder 21 composed of an elastic material 23 having holes 24 is prepared, and the component bodies 2 of the electronic chip components are respectively inserted into the holding holes 24 with the end faces 5 of the component bodies 2 on opening sides 25 of the holes 24 so that peripheral walls 26 specifying the openings of the holes 24 may cover the peripheral sections of the end faces 5 due to the elasticity of the elastic material 23. In this state, the external electrodes 3 are formed on the end faces 5 directed to the openings 25 of the holes 24 of the component bodies 2 held by the holder 21 by dry- plating. Other external electrodes are also formed on the other end faces 6 of the component bodies 2 of the electronic chip components by also performing the same step on the end faces 6. COPYRIGHT: (C)2003,JPO
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