SEMICONDUCTOR MEMORY DEVICE AND MULTI-CHIP MODULE

摘要

PROBLEM TO BE SOLVED: To constitute appropriately a chip connection part independently of volume of capacity of a provided memory cell array in a semiconductor memory device which is constituted of semiconductor chips and is stuck on a surface of the other semiconductor chip, and used by joining.

SOLUTION: In a control circuit 201 provided in the semiconductor memory device, a chip connection part 300 provided with pads 301-306 is constituted so as to correspond to the maximum capacity of a memory cell array provided in the semiconductor memory device, and even when having a memory cell array having capacity being less than the maximum capacity, arrayed places and the number of these pads 301-306 are decided fixedly. The control circuit 201 having the chip connection part 300 also is decided fixedly independently of capacity of a provided memory cell array so that read and write of data for the memory cell array of the maximum capacitor can be controlled.

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