| 摘要 |
<P>PROBLEM TO BE SOLVED: To separate an intended defect from a number of defects of a circuit pattern and select the same. <P>SOLUTION: In this inspection device, an electron beam 71 is applied to a sample 61 where a pattern is formed on the surface thereof to detect the secondary electrons 72 generated from the sample, thereby detecting the defect part of the pattern. During inspection, the sum of gradation differences of abnormal parts (defect parts) from an inspected image and a reference image is found by a feature amount operation of an image processor 58, and after inspection, the sum of the gradation differences is divided by the area of the abnormal part with a host computer 59 to obtain the average value of the gradation differences. According to the average value of the gradation difference of the abnormal part, grouping is performed, and the group having a specified defect is selectively confirmed from the classified groups. <P>COPYRIGHT: (C)2003,JPO |
