| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conveying mechanism capable of conveying a plate such as a semiconductor wafer or the like stuck to a protection tape mounted on a support frame without causing damages. <P>SOLUTION: In a conveying mechanism, plates are stuck to the upper surface of a protection tape mounted so as to cover an inside opening of a support frame formed annularly. The conveying mechanism comprises a suction holding member 22 which comprises a negative pressure chamber 223 opened downward, has an annular contact part coming into contact with the upper surface of the support frame on the lower surface, and in which the negative pressure chamber is connected to a suction source; and a moving mechanism for moving the suction holding member between a first predetermined position and a second predetermined position. <P>COPYRIGHT: (C)2003,JPO</p> |
