| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring substrate capable of retaining strongly a connecting force between a soldering terminal and a land and of improving the precision of a soldering terminal connecting position to the land. <P>SOLUTION: The soldering terminal 4 is connected only to a perfect circle land 2 by improving the soldering capability of the land 2 by using a circuit pattern 3. Consequently, the formation of an asymmetrical projection in the soldering terminal 4 can be avoided. Therefore, since a stress-concentrated portion is not formed in the soldering terminal 4, the connecting force between the soldering terminal 4 and the land 2 can be retained. Further, since the shape of the soldering terminal becomes one corresponding to that of the land 2, the center of the soldering terminal 4 can be conformed easily to that of the land 2. As a result, the precision of the connecting position between those can be improved. <P>COPYRIGHT: (C)2003,JPO</p> |
