| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device, and its evaluating method and manufacturing method. SOLUTION: A semiconductor device comprising a semiconductor layer 1, a gate insulation film 2, a gate electrode 3, an offset spacer layer 4, and an SD extension diffusion layer 6 subjected to ion implantation using the gate electrode 3 and the offset spacer layer 4 as a mask is manufactured by varying the thickness of the offset spacer layer 4 and each leak current level is measured. It can be seen that the film thickness of the offset spacer layer 4 has a correlation with the leak current level, and the film thickness of the offset spacer layer 4 is equal to the length from a part of the semiconductor layer 1 touching the outer end of the offset spacer layer 4 to the forward end of an impurity diffusion layer when the leak current level is 0. COPYRIGHT: (C)2003,JPO
|
