BUMP FORMING METHOD, BUMP ATTACHED SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, SUBSTRATE AND ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To simply form a bump easy to be connected by means of wire bonding.

SOLUTION: A bump forming method includes processes as follows; (a) a point 22 formed in a ball-shape in a wire 20 is bonded to an electrode 12 by using a tool 30, (b) a part 24 of the wire 20 is drawn from the point 22 that has been bonded, (c) a portion continued from the point 22 of the wire 20 is squashed on the point 22 to form a bump 40 on the electrode 12, (d) the wire 20 is cut with the bump 40 allowed to remain on the electrode 12.

COPYRIGHT: (C)2003,JPO