| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for semiconductor device accommodation that can input and output a high-frequency signal having a high-frequency band of approximately 2 to 25 GHz with low loss. <P>SOLUTION: The package has a substrate 1 composed of an insulating material where a mounting section for mounting a semiconductor device 2 on the bottom surface of a recess 1a on an upper surface is provided and is set to be a nearly rectangular parallelepiped, a metallized layer 1c formed at the outer periphery of the lower surface of the substrate 1, and a lead terminal 5 that comprises an upper end joined to the metallized layer 1c, a middle section 5a slantingly extending from the upper end to a lower portion outside the substrate 1, and a lower end nearly in parallel with the upper end. In the lead terminal 5, the upper end and the middle section 5a are provided inside of an extended surface on the side of the substrate 1. <P>COPYRIGHT: (C)2003,JPO</p> |
