| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a reinforcing material for semiconductor device to facilitate the handling of a thin semiconductor device by reinforcing it. <P>SOLUTION: In a process for manufacturing a semiconductor device 9 by bonding a reinforcing member 14a to a thin semiconductor element 1a, the reinforcing material for the semiconductor device used as a material of the reinforcing member 14a is composed of a thin planar main plate, and an adhesive layer 4b of resin adhesive material having a low elastic modulus formed on one side of the main plate. The material is selected such that, under assembled state of the semiconductor device 9, the bending rigidity of the reinforcing member 14a is higher than that of the semiconductor element 1a, and thickness dimensions are set such that the adhesive layer 4b allows the deformation of the semiconductor element 1a under a state where the reinforcing member 14a is bonded to the semiconductor element 1a. According to the arrangement, the handling of the thin semiconductor element 1a can be facilitated by reinforcing it. <P>COPYRIGHT: (C)2003,JPO</p> |
