| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that much manufacture cost is required since an expensive bonding tool is required for mounting the LED elements of flip chips on a substrate by ultrasonic wave bonding and the LED elements are to be bonded one by one when they are manufactured by using the aggregate substrate including a plurality of substrate regions in the manufacture of light emitting diodes. <P>SOLUTION: The flip chip group of the LED elements 3 is bonded to an adhesive sheet 21 in an arrangement similar to the individual substrate regions on the aggregate substrate 11. The adhesive sheet is reversed and is brought close to a paste plate 26. Bumps 3a are brought into contact with paste solder 27 and they are bonded. The bumps are overlapped with the connection electrodes of the aggregate substrate. They are heated, re-flowed and the LED elements are mounted. The adhesive sheet is peeled off and a transparent cover material 28 is bonded to the upper face of the aggregate substrate. When it is diced along the boundary 17 of the individual regions, split pieces become the finished products of the light emitting diodes and they can efficiently be manufactured. <P>COPYRIGHT: (C)2003,JPO |
