METHOD FOR MOUNTING HEAT SINK ONTO CAVITY DOWN PLASTIC CHIP CARRIER

摘要

PROBLEM TO BE SOLVED: To provide a method for mounting a heat sink to a cavity-down plastic chip carrier in which the phenomenon of warping or twisting is prevented from occurring on a chip package. SOLUTION: A bonding sheet is provided for bonding a substrate and the heat sink and the bonding sheet is composed by superimposing single or multiple adhesive layers. The adhesive layer is composed of flake filled adhesives, fiber filled adhesives or grain filled adhesives. An opening is formed in the substrate used for installing a chip. The heat sink is a thin copper sheet with a thickness greater than 0.254 mm or a thin copper alloy sheet with a thickness greater than 0.1 mm. COPYRIGHT: (C)2003,JPO