| 摘要 |
PROBLEM TO BE SOLVED: To facilitate inspection and maintenance. SOLUTION: Chassis 42, 44 are respectively mounted on both surfaces of a heat sink fin 40. Printed circuit boards 46, 48 are detachably provided outward of the chassis 42, 44. Semiconductor modules 6, 16a, 16b and 32 are mounted on the surfaces of the fin 40 opposed to the circuits 46, 48 through the chassis 42, 44. The modules are electrically connected to the boards 46, 48 to constitute a power source circuit. COPYRIGHT: (C)2003,JPO |
