发明名称 SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing method which is improved in throughput, capable of saving intermediate rinses, and diminishing a drainage disposal cost by dispensing with an intermediate rinse process. SOLUTION: At first, a substrate is rotated at a low speed by a spin chuck. In this state, a remover is fed to the surface of the substrate W from a remover feed mechanism so as to remove reaction products on the substrate W. Then, the remover is stopped, and then pure water is supplied from a pure water feed mechanism. After the substrate is cleaned with the pure water, the pure water is stopped. The substrate W is rotated at high speed by the spin chuck to enable the pure water left on the substrate W to fly away and dried out. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003243349(A) 申请公布日期 2003.08.29
申请号 JP20020041144 申请日期 2002.02.19
申请人 DAINIPPON SCREEN MFG CO LTD;FUJITSU VLSI LTD;FUJITSU LTD 发明人 SUGIMOTO HIROAKI;IMAI MASAYOSHI;SANO SEIJI
分类号 G03F7/42;H01L21/027;H01L21/304;(IPC1-7):H01L21/304 主分类号 G03F7/42
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