| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for housing optical semiconductor element that is improved in airtightness and reduced in size and weight and, at the same time, to solve the problem that stresses are applied to a translucent member and remove the member or break the airtightness of the member, when an outer peripheral section of a holding member is bonded to the end face of an optical fiber fixing member with a low-melting point brazing material after the translucent member is bonded to the holding member with low-melting point glass. SOLUTION: The optical fiber fixing member 3 has a step section formed over full periphery of the member 3 at the central part so that an inside diameter of a frame 2 becomes smaller than an outside diameter of the frame 2. At the same time, the portion of the member 3 on the frame 2 side from the step section is fitted into a through hole 2a, and the interval between the inner peripheral surface of the member 3 and the outer peripheral surface of cylindrical section of the holding member 3c is adjusted to≥0.5 mm. COPYRIGHT: (C)2003,JPO
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