| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a flexible printed circuit board having multilayer structure in which adverse effect of local temperature rise is suppressed. <P>SOLUTION: The multilayer flexible printed circuit (FPC) 1 has such a structure as FPCs 4a-4d are stacked and the fuses 6 and 7 of heat generating electronic components exhibiting a high heating value at the time of conduction are distributed at a specified interval (a) and packaged. Since heat generated from the fuses 6 and 7 is not concentrated locally but diffused and dissipated, local temperature rise of the circuit in the multilayer FPC 1 is suppressed thus suppressing temperature rise of the entire circuit. <P>COPYRIGHT: (C)2003,JPO</p> |
