| 摘要 |
PROBLEM TO BE SOLVED: To securely cool down a number of capacitors on a substrate. SOLUTION: The device is provided with a substrate 2 for fitting electronic components such as capacitors 3 constituting an inverter circuit, holding pedestals 5 consisting of frame parts 6, holding parts 5 fitted inside the frame parts 6, and leg parts 8 integrated with the frame parts 6, and a ventilating means 4. In fitting the capacitors 3 to the substrate 2, it is so structured that the holding pedestals 5 holding the capacitors 3 are fitted to the substrate 2. With this, air flow paths 10 will be made between the capacitors 3 and the substrate 2 for airstream from the ventilating means 4 to pass well, surely enabling cooling of the capacitors 3. COPYRIGHT: (C)2003,JPO |
