| 摘要 |
PROBLEM TO BE SOLVED: To develop a method for preventing thermal elongation/shrinkage of a printed circuit board even if it is subjected to temperature variation in the process of exposure, development, drying, or the like, and to realize high accuracy and high density of a multilayer printed circuit board, in particular. SOLUTION: In the method for preventing thermal elongation/shrinkage, a main plate 1a for preventing thermal elongation/shrinkage is formed of a non-thermal elongation/shrinkage material having a low thermal expansion coefficient, and a temperature-sensitive adhesive layer 1b switching between adhesive property and nonadhesive property depending on the temperature region is formed on the surface of the main plate 1a for preventing thermal elongation/shrinkage, thus preparing a thermal elongation/shrinkage preventing plate 1. An article, e.g. a printed circuit board, is bonded fixedly to the surface of the temperature-sensitive adhesive layer 1b in the adhesive temperature region, and thermal elongation/shrinkage of the printed circuit board, or the like, is prevented by the adhesiveness of the adhesive layer 1b even if a temperature variation takes place in the intermediate processing of exposure, development, drying, or the like, and then the printed circuit board, or the like, can be separated easily from the adhesive layer 1b in the nonadhesive temperature region. This method is especially effective in a multilayer printed circuit board 48 and the internal circuit can be aligned readily with high accuracy, by sustaining the size of the printed circuit board with high accuracy for each layer and simply making flush the opposite ends at the time of building into multilayer. COPYRIGHT: (C)2003,JPO |
