发明名称 RESIN FRAME AND METHOD OF BONDING PROCESS CARTRIDGE
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin frame which eliminates the torque increase and uneven rotation occurring in the twisting produced by fixing of frames to each other in a cartridge state and provides the reduction of a cost and man-hours for assembly by the curtailment of screws and the simplification of bonding process steps and a method of bonding a process cartridge. <P>SOLUTION: Side covers and a developing device unit are fixed in the state of maintaining the spacing in a longitudinal direction before joining by performing resin joining. Namely, a photoreceptor unit and the developing device unit can be bonded by eliminating the torque increase and uneven rotation occurring in the twisting and the distortion of the side covers. Since the curtailment of the screws and the bonding process steps is simple, the method is effective in the reduction of the cost and the man-hours for assembly. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003241619(A) 申请公布日期 2003.08.29
申请号 JP20020043165 申请日期 2002.02.20
申请人 CANON INC 发明人 SUZUKI AKIRA;YOKOI AKIYOSHI;OGUMA TORU;ABE KENSHIRO
分类号 G03G21/18;B29C65/40 主分类号 G03G21/18
代理机构 代理人
主权项
地址