| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain pattern inspection equipment in which pattern inspection can be carried out in all manufacturing processes for a semiconductor device without rewriting an inspection program. <P>SOLUTION: In the pattern inspection of a semiconductor device, a basic pattern used for correcting the mounting position of a sample substrate on a supporting base is recorded previously, the positional shift of mounting is corrected using the basic pattern, the image of a pattern formed on the sample substrate mounted on the supporting base is acquired, and then the defect of the pattern is detected from the image thus acquired. When the manufacturing process of the sample substrate progresses subsequently and variation is detected in the shape of the basic pattern, a new pattern used for correcting the mounting position of the sample substrate on the supporting base is recorded temporarily, and the positional shift is corrected when mounting the sample substrate on the supporting base using the new pattern recorded temporarily. <P>COPYRIGHT: (C)2003,JPO |
