SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device in which internal destruction caused by a difference in internal thermal stresses of members comprising the semiconductor device does not occur in the resin-sealed semiconductor device in which a die pad is exposed outside a package, and a manufacturing method for the semiconductor device.

SOLUTION: The semiconductor device is composed of a die pad 14 for placing a semiconductor chip 12 thereon, a lead frame 16 formed of an inner lead 16a electrically connected with the die pad 14 and the semiconductor chip 12 and an outer lead 16b as an external terminal of a semiconductor device 10, and a sheet metal 18 located at the terminal of the package facing the die pad 14.

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