| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevents fading of wafer printing. <P>SOLUTION: A print which is an identification number is formed by digging down a silicon substrate 6 with a laser. As an interlayer insulating film, a connection hole and a metal wiring layer are formed on the silicon substrate 6, insulating films 7, 8, a metal film for the connection hole 9 and a metal film for wiring 10 are stacked sequentially. A resist pattern is not formed in regard to the metal film for the wiring 10 stacked on a printing part, and the metal film for the wiring 10 of this part is removed by etching. <P>COPYRIGHT: (C)2003,JPO</p> |
