发明名称 RESISTANCE PLATE LAMINATED MATERIAL AND COMPONENT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a resistance plate laminated material which is capable of forming a resistor having a prescribed resistance value in a wiring pattern formed by etching and a component using the same. SOLUTION: Conductive plates 24 having superior conductive properties and resistance plates 28 each having prescribed resistivity are prepared, the surfaces of the plates 24 and 28 to be bonded are subjected to an activation treatment, the plates 24 and 28 are laminated and bonded together into a resistance plate laminated material 22 as their treated surfaces are abutted so as to face each other so that a resistor having a prescribed resistance value can be formed in a wiring pattern. Components applied to a printed wiring board, an IC package and the like are manufactured by use of the resistance plate laminated material 22. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003243794(A) 申请公布日期 2003.08.29
申请号 JP20020039616 申请日期 2002.02.18
申请人 TOYO KOHAN CO LTD 发明人 SAIJO KINJI;YOSHIDA KAZUO;OSAWA SHINJI
分类号 H05K1/16;B32B7/02;B32B7/08;H01L23/12;H01L23/50;H05K1/09;H05K3/38;(IPC1-7):H05K1/16 主分类号 H05K1/16
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