| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device and a method for flexible substrate, in which electrodes such as outer lead and inner lead of a flexible substrate such as a film carrier are correctly matched with electrodes of objects such as a display panel and a flip-chip as electronic components. SOLUTION: A distance between the point A1 and point A2 of the film carrier 2A is measured by cameras 22, 23, and a difference (target distance) between the point B1 and the point B2 of a display panel 5 as the target distance is also obtained. The film carrier 2 is heated at a heating portion 21 and expanded, to make zero the difference, and the outer lead 4 is positioned to the electrode 8 of the display panel 5. Moreover, a thermal pressure-bonding tool is pressed toward the film carrier 2 for the bonding process. COPYRIGHT: (C)2003,JPO
|
