| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To separate a thin semiconductor chip 2 stuck to an adhesive sheet 3 for an adhesive sheet 3. <P>SOLUTION: A part of the back of the adhesive sheet 3 corresponding to the peripheral part of a semiconductor chip 2 stuck to the surface of the adhesive sheet 3 is pushed up by using a first push up needle 11A and a second push up needle 11B. Next, the back of the adhesive sheet corresponding to the central part of the semiconductor chip is further pushed up by using the first push up needle 11A, whereby adhesive strength between the semiconductor chip and the adhesive sheet can be weakened. The total height pushed up by the second push up needle 11B is about double the push up height by the first push up needle 11A. <P>COPYRIGHT: (C)2003,JPO</p> |
