SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package from which an outgas in the package can be dissolved and removed effectively and surely without hindering optical characteristic of a light emitting device. SOLUTION: In this semiconductor package which fixes the light emitting device containing a semiconductor or a component using the semiconductor, a titanium oxide or a mixture of the titanium oxide is formed on at least one surface of an internal wall of the semiconductor package or at least one surface of the semiconductor or the component using the semiconductor fixed in the package. COPYRIGHT: (C)2003,JPO