发明名称 SOLID-STATE IMAGE PICKUP ELEMENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a solid-state image pickup element and its manufacturing method wherein the number of processes is reduced as compared with the conventional case, cost reduction is enabled, light shielding capability to an output part is improved, and decrease of reliability can be prevented. SOLUTION: An FD electrode 55 as wiring for leading out a signal which is connected with an FD region of the output part 35 is formed before a flattening film 57 covering transfer electrodes 47, 48 is formed. A first light shielding part 58A and a second light shielding part 58B which cover a horizontal transfer register 34 and a reset gate 53 of the output part 35, respectively, are formed on the flattening film 57 by using a common light shielding film 58. The FD electrode 55 is constitutes of high melting point metal material (e.g. tungsten) which can endure flattening heat treatment of the flattening film 57. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003243645(A) 申请公布日期 2003.08.29
申请号 JP20020045148 申请日期 2002.02.21
申请人 SONY CORP 发明人 WADA KAZUJI
分类号 H01L27/148;H01L21/339;H01L27/14;H01L29/762;H04N5/335;H04N5/369;H04N5/372;(IPC1-7):H01L27/148 主分类号 H01L27/148
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