发明名称 SOLID-STATE IMAGE PICKUP DEVICE
摘要 PROBLEM TO BE SOLVED: To enable high speed transfer of electric charges by reducing electric resistance of a transfer electrode in the case of microminiaturization, in a solid- state image pickup element capable of reading all picture elements. SOLUTION: A light receiving part adjacent to a light receiving part 105 is arranged at a position where one-half of a picture element pitch in a horizontal direction and in a vertical direction is shifted. Picture element arrangement in the light receiving part 105 is made a honeycomb type. In this so-called honeycomb CCD, metal wiring 125 is electrode material whose resistivity is smaller than that of transfer electrodes 111-114 constituted of two-layer polysilicon electrode. The metal wiring 125 is laminated and arranged in the transversal direction along the longitudinal direction of the transfer electrodes 111-114. Corresponding to each of the transfer electrodes 111-114, the metal wiring is connected by using contact holes 126. As a result, the electric resistance is reduced without thickening the polysilicon layer of the transfer electrodes 111-114. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003243642(A) 申请公布日期 2003.08.29
申请号 JP20020036728 申请日期 2002.02.14
申请人 FUJI PHOTO FILM CO LTD;FUJI FILM MICRODEVICES CO LTD 发明人 SHIZUKUISHI MAKOTO
分类号 H01L27/148;H01L21/3205;H01L23/52;H04N5/335;H04N5/369;H04N5/3722;(IPC1-7):H01L27/148;H01L21/320 主分类号 H01L27/148
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