| 摘要 |
PROBLEM TO BE SOLVED: To prevent the strip of a conductive pattern or corner cracking in a wiring board. SOLUTION: The terminal structure of a wiring board comprises a lower layer (5) having a plurality of side through holes opening sideward, an upper layer (3) having a lower surface (3b) facing the side through hole (7) and a corner (3a), a conductive pattern (13) provided on the lower surface (3b) of the upper layer, and an electrode (11) provided on the inner wall (7w) of the side through hole and capable of conducting with the conductive pattern (13). The conductive pattern (13) is formed not to face the side through hole (7) so that a solder fillet (9) does not reach the vicinity of the corner part (3a) at the time of reflow. The strip of the conductive pattern or corner cracking due to the difference of thermal expansion coefficients between the wiring board (1) and a mother board (21) or difference of shrinkages of solder fillets at different positions can thereby be prevented. COPYRIGHT: (C)2003,JPO
|
