| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device in which a problem caused by the leak of brine circulating for cooling an integrated circuit element can be effectively solved. SOLUTION: A circuit board packaged with the integrated circuit element is housed in a case 3. The device is equipped with a cold plate mounted onto the integrated circuit element, a heat exchanger 11 for cooling the brine heated by the cold plate, a reserve tank 26, a pump 15 and a path of the brine buried in the cold plate. Then, a conduit space for locating piping forming the circulation course of the brine circulating between the cold plate and the heat exchanger is located on one side in the case, and the bottom of the conduit space is made lower than the heat exchanger. COPYRIGHT: (C)2003,JPO
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