| 摘要 |
PROBLEM TO BE SOLVED: To manufacture electronic components with an electric wire that is high in insulation resistance and tensile strength by modifying the surface of an insulation film to be embedded in a resin mold and joining tightly the insulation film with a resin molded body. SOLUTION: Ultraviolet rays are applied for surface modification, that is, to cut the surface of an insulation film 11 covering a specified length from lead ends of bare wires 10a and 10b into a principal chain molecule and a side-chain molecule. The modified insulation film 11 is embedded inside by a specified length, a resin molded body 3 is joined tightly with the insulation film 11, and then an electronic part 2 including the joint part with the bare wires 10a and 10b is entirely and air-tightly sealed with the resin molded body 3. COPYRIGHT: (C)2003,JPO
|
