Hot-melt adhesive composition for use e.g. in cars or packaging, comprising a polyolefin-polyamide graft copolymer and a mixture of tackifier resin and optionally wax, plasticizer and/or filler

摘要

Hot-melt adhesive compositions based on a polyolefin-polyamide graft copolymer in which the polyamide (with a molecular weight (Mn) of 1000-5000 and a melting point of 100-190degreesC) is attached to the grafting base with unsaturated carboxylic acid, anhydride or epoxide residues by grafting or copolymerization at the double bond. Hot-melt adhesive compositions (I) comprising: (a) 20-80 wt% of a mixture of: (A) 50-100 wt. % graft copolymer consisting of polyamide grafted onto a polyolefin base; and (B) 0-50 wt. % polyolefin(s) and/or polyamide(s); and (b) 80-20 wt. % of a mixture containing tackifier resin(s) and optionally wax, plasticizer(s) and/or mineral filler(s). In component (A), the polyamide is attached to the grafting base by residues (X) of unsaturated carboxylic acid and/or unsaturated acid anhydride and/or unsaturated epoxide which are attached to the base by grafting or copolymerization at the double bond. The grafted polyamide units have a number-average molecular weight (Mn) of 1000-5000 and a melting point of 100-190degreesC. Copolymer (A) shows an MFI of 1-500 g/10 min at 190 degreesC using 2.16 kg of polymer (190/2.16).