| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component having a micro-capacitor of a high capacitance value. SOLUTION: In an integrated circuit and the electronic component having a planar micro-capacitor integrated thereinto which are formed on a substrate (1), the capacitor is so formed on the uppermost surface of the metallization surface of the component that the metallization surface is formed into a first electrode (2) of the capacitor. Further, the capacitor has a first barrier layer (5) containing diffused oxygen which is deposited on the uppermost surface of the metallization surface (2); stacks (6) of a plurality of different oxide layers having their respective thicknesses not larger than 100 nm deposited on the uppermost portion of the first barrier layer (5); a second barrier layer (7) containing diffused oxygen which is deposited on the uppermost portion of the stack (6) of the oxide layer; and a metal electrode (20) present on the uppermost portion of the second barrier layer (7). COPYRIGHT: (C)2003,JPO
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