| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer treatment apparatus for positively controlling temperature distribution of a semiconductor wafer that is being etched in a clear state. <P>SOLUTION: Independent slits 11 and 12 for circulating coolants are provided at an inner and outer peripheries in an electrode block 1. At the same time, a slit 13 is formed between them, and heat conduction is inhibited between the inner and outer peripheries. Since the unification of temperature in the electrode block 1 is inhibited by the slit 13, inside of the surface of the electrode block 1 can be set to an arbitrary, independent temperature, and the positive and clear control of a temperature distribution pattern can be obtained. <P>COPYRIGHT: (C)2003,JPO |
