Electronic component used as a semiconductor chip comprises an electrically conducting adhesive layer between the metallic surfaces of components of the electronic component

摘要

Electronic component comprises an electrically conducting adhesive layer (2) between the metallic surfaces (3) of components (4) of the electronic component (1). The metallic surfaces lie opposite each other and the adhesive (5) has agglomerates (6) of electrically conducting nano-particles (7) having electrically conducting paths (9) surrounding the nano-particles in the adhesive base composition. Electronic component comprises an electrically conducting adhesive layer (2) between the metallic surfaces (3) of components (4) of the electronic component (1). The metallic surfaces lie opposite each other and the adhesive (5) has agglomerates (6) of electrically conducting nano-particles (7) having electrically conducting paths (9) surrounding the nano-particles in the adhesive base composition. The opposite-lying surfaces are electrically connected via a number of agglomerates of electrically conducting nano-particles distributed in the adhesive layer. An Independent claim is also included for a process for the production of an electronic component.