发明名称 Curable composition for heat conductive material
摘要 The invention provides a curable composition for a heat conductive material, having an excellent durability, a satisfactory heat conductive property and a high productivity with easily controllable surface tackiness, a heat conductive material obtained from such curable composition and a method for controlling the surface tackiness of the composition after curing. The curable composition for the heat conductive material is formed by a curable composition of heat curable type based on crosslinking by a hydrosilylation reaction and including a saturated hydrocarbon polymer containing at least an alkenyl group in a molecule, a curing agent containing at least two hydrosilyl groups in a molecule and a hydrosilylation catalyst, to which a heat conductive filler is incorporated, thereby providing a flexible elastomer with a satisfactory heat conductivity and with an easily controllable surface tackiness.
申请公布号 US2003160207(A1) 申请公布日期 2003.08.28
申请号 US20030361567 申请日期 2003.02.11
申请人 KANEKA CORPORATION 发明人 SAKAGUCHI MASASHI
分类号 C08K3/22;C08K5/5419;C08L23/22;C08L83/04;(IPC1-7):C09K5/00 主分类号 C08K3/22
代理机构 代理人
主权项
地址