发明名称 PROCESS FOR PRODUCING ELECTRICAL APPARATUS
摘要 A process for producing an electrical apparatus by electrically and mechanically bonding two objects to be bonded to each other, which comprises hot-pressing an adhesive layer (25) formed on an LCD (11) against a second hardener layer (28) formed on a TCP (15) while keeping them in close contact with each other, whereby a first hardener contained in the adhesive layer (25) reacts with a second hardener constituting the second hardener layer (28) to polymerize a thermosetting resin contained in the adhesive layer (25) and thereby bond the LCD (11) to the TCP (15). When a metal chelate or metal alcoholate and a silane coupling agent are used respectively as the first and second hardeners, then cations generate by the reaction of the silane coupling agent with the metal chelate and the thermosetting resin undergoes cationic polymerization due to the cations. Thus, in bonding the LCD (11) to the TCP (15), the adhesive can be cured at a lower temperature in a shorter time than conventional adhesives.
申请公布号 WO03070847(A1) 申请公布日期 2003.08.28
申请号 WO2003JP01591 申请日期 2003.02.14
申请人 SONY CHEMICALS CORPORATION;MATSUSHIMA, TAKAYUKI;SAITO, MASAO 发明人 MATSUSHIMA, TAKAYUKI;SAITO, MASAO
分类号 C09J5/00;C09J5/06;H05K3/32;(IPC1-7):C09J5/00;C09J201/00;C09J163/00;H05K3/36 主分类号 C09J5/00
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