发明名称 |
Characteristics evaluation of intermediate layer circuit |
摘要 |
The circuit characteristics of an intermediate layer between an uppermost layer and a lowermost layer of a ceramic multilayer substrate with substrates laminated can be evaluated. A method for evaluating the characteristics of the intermediate layer circuit is provided. The intermediate layer circuit is installed on the intermediate layer of the multilayer substrate and has a wiring and a grounding pad, holding grounding potential, formed in the vicinity of the wiring. The method includes steps of: irradiating a region of the upper layer substrate located above the grounding pad of the intermediate layer with laser to scrape to a predetermined thickness; polishing the upper layer substrate scraped to the predetermined thickness with a hard polishing tool to expose the wiring and/or grounding pad; and bringing a probe needle in contact with the exposed wiring and/or grounding pad to evaluate characteristics of the intermediate layer circuit.
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申请公布号 |
US2003162310(A1) |
申请公布日期 |
2003.08.28 |
申请号 |
US20020245675 |
申请日期 |
2002.09.18 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
NAKATUKA SHIGENORI;INOUE AKIRA;CHOUMEI KENICHIRO |
分类号 |
G01R27/28;G01N1/32;G01R31/00;G01R31/28;G01R31/40;H05K1/02;H05K3/00;H05K3/46;(IPC1-7):H01L21/66;G01R31/26 |
主分类号 |
G01R27/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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